Abstract
In this paper, a soft-error-aware radiation-hardened 6T SRAM cell has been implemented using germanium-based dopingless tunnel FET (Ge DLTFET). In a circuit level simulation, the device-circuit co-design approach is used. Semiconductor devices are very prone to the radiation environment; hence, finding out the solution to the problem became a necessity for the designers. Single event upset (SEU), also known as soft error, is one of the most frequent issues to tackle in semiconductor devices. To mitigate the effect of soft error due to single-event upset, the radiation-hardening-by-design (RHBD) technique has been employed for Ge DLTFET-based SRAM cells. This technique uses RC feedback paths between the two cross-coupled inverters of an SRAM cell. The soft-error sensitivity is estimated for a conventional and RHBD-based SRAM cell design. It is found that the RHBD-based SRAM cell design is more efficient to mitigate the soft-error effect in comparison to the conventional design. The delay and stability parameters, obtained from the N-curve, of the Ge DLTFET-based SRAM cell performs better than the conventional Si TFET-based SRAM cell. There is an improvement of 305x & 850x in the static power noise margin and write trip power values of the Ge DLTFET SRAM cell with respect to the conventional Si TFET SRAM cell.
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