Abstract
The world’s smallest discrete capacitor was invented in a cylindrical form factor for high-frequency power delivery, contrary to a planar capacitor such as MLCC. A dielectric layer of Al2O3 (5~50nm ALD) was deposited on conventional Au metal wires (18~40µm), and subsequently, a 2nd electrode metal (0.5~1µm) was sputtered on the Al2O3 layer. Advanced wire bonding was used to assemble CCW to PCB pads for electrical connections required capacitors. Electrical simulations were used to characterize CCW in terms of electrical performances. The capacitance measurements were compared between CCW & MLCC in conjunction with electrical simulation at high frequencies for RF & HPC applications. CCW can also be embedded into PCB and integrated into package chips.
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