From MEMS Strip to MEMS Unit: a Comprehensive Simulation Approach to Warpage

Abstract

The paper suggests a simulation flow methodology suitable for MEMS package designers that can help R&D teams to develop industrially feasible products by achieving consistent warpage prediction results, both at unit and strip levels. Striplevel- wise, one of the most important findings of this activity is the direct impact of raw material selection. Unit-level-wise, it allows checking a priori and in different conditions (inside the socket or mounted on a PCB for example) stress distribution on different elements of the assembled MEMS unit.