Abstract
Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in Industrial, Automotive and Consumer electronics. TIMs comprise of a compliant polymeric matrix with thermally conductive fillers. Silicones are the polymer of first choice due to the special characteristics of thermal stability and ability to fine tune the modulus across a wide range. Silicone migration can be a concern, whether real or through perception. Here we describe various types of silicone migration quantitatively in terms of polymer basics. We will describe analytical methods characterizing migration and provide typical quantitative ranges. We also address what the real risks are for specific applications, quantitative as well as qualitative. Finally, we will describe mitigation measures, if needed, through silicone modification or replacement with other polymers.
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