Abstract
High energy borane (B 2 H 6 ) gas cluster ion beam (GCIB) successfully enables a sub-10nm box-shaped dopant profile without channeling tail, and steep gradient (2.5nm/dec) in lateral direction. pFET using GCIB source/drain extension shows superior suppression of short channel effects and reduces the dependency of drive current on gate overlap capacitance variation for scaled devices. Moreover, the perimeter leakage component in p+/n-well junction was reduced compared to the conventional co-implantation process with pre-amorphization, which might come from novel self-amorphization mechanism by energized clusters without foreign impurities such as Ge and F. For further scaled devices, GCIB can provide more efficient boron activation by laser spike annealing (LSA) while maintaining the scaled extension profile by combination with the reduced temperature spike RTA.
Published Version
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