RF Device Integration on Glass Interposer toward 3D-IPAC Packages

Abstract

3D Integrated Passive and Actives Component (IPAC) is a new concept of ultra-miniaturized and highly functional sub-systems, which enables one to achieve higher RF functionality in a single module. As the first step, this paper demonstrates the concept of integrating passive components using 100μm ultra-thin glass and small Through Package Vias (TPVs) by ArF excimer laser. Passive low pass filters (LPF) for WLAN in thin dielectrics on glass were designed using circuit simulator and EM solver. The LPFs were fabricated using low-cost panel based processes, and then assembled onto the Printed Wiring Board (PWB). The filters on either side of the glass interposer were measured at the board level, and the results corroborated well with EM simulations. The measurement results showed low insertion loss (about −1dB) and high rejection (<−20dB). The integration of passive components using double-side and ultra-thin glass interposers with small TPVs, enables one to shrink RF module size.