Abstract
Due to its superior electrical and thermal characteristics, silicon carbide power modules will soon replace silicon modules to be mass-produced and implemented in all-electric and hybrid-electric vehicles (HEVs). Redesign of the power modules will be required to take full advantage of these newer devices. A particular area of interest is high-temperature power modules, as under-hood temperatures often exceed maximum silicon device temperatures. This review will examine thermal packaging options for standard Si power modules and various power modules in recent all-electric and HEVs. Then, thermal packaging options for die-attach, thermal interface materials (TIM), and liquid cooling are discussed for their feasibility in next-generation silicon carbide (SiC) power modules.
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