Abstract
We present the fabrication of a polyimide microcantilever array with integrated gold piezoresistive strain gauges and a thick SU-8 backing for use as a surface stress sensor. The selected polyimide’s low Young’s modulus (1.8GPa) theoretically results in a high sensitivity to changes in surface stress. Electroplated gold contact pads, 1.5μm thick, provide a stable, repeatable surface onto which electrical connections to the fabricated device are made using spring-loaded microprobes. The piezoresistors are found to have a gauge factor of between 4 and 4.5 and a sensitivity to surface stress of 2.1×10−4(N/m)−1.
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