Abstract
The changes in surface stress of Au electrode (mainly oriented to (111) plane) during underpotential deposition (UPD) of Bi and Pb were measured by a bending beam method to investigate the relation between surface stress and structure of the adlayer. The surface stress changed to the compressive direction as Bi- or Pb-UPD proceeded. The changes in surface stress to the compressive direction responded sensitively to the structural changes of the Bi- or Pb-adlayer. The biaxial modulus of (p x root 3)-2Bi monolayer or hexagonal close-packed Pb monolayer on Au (111) electrode was estimated from the relation between the changes in surface stress and the surface elastic strain of the monolayer obtained by surface X-ray scattering. The factors influencing the changes in surface stress during UPD of Bi or Pb were discussed in connection with the structural changes of the adlayer.
Published Version
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