Abstract
To clarify the effectiveness of a collimator in collimation sputtering, the film fabrication process is numerically examined by the test-particle Monte Carlo method. Distribution of film thickness and coverage of contact hole are analysed under various conditions of the following parameters: collimator thickness, deposition probability for collimator, collimator location, and background gas pressure. Under the condition of uniform erosion, which is most favourable to collimation sputtering, the increase in collimator thickness remarkably improves the overall uniformity of film and the bottom coverage of the contact hole in exchange for a substantial decrease of the film growth rate. The increase in deposition probability, approach of the collimator to wafer, and rarefaction of background gas also enhance the effectiveness of the collimator. However, the enhancement is not so drastic as the increase in collimator thickness.
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