Abstract
To clarify the effect of a collimator in the collimation sputtering method, the film fabrication process in this apparatus is numerically examined by the test particle Monte Carlo method. Distribution of film thickness and coverage of contact hole are analyzed under various conditions given the following parameters : collimator thickness, deposition probability for collimator, collimator location, and background gas pressure. The increase in collimator thickness remarkably improves the overall uniformity of film and the bottom wall coverage of the contact hole, while the film growth rate decreases. The increase in deposition probability, approach of the collimator to wafer, and rarefaction of background gas also enhance the efficiency of the collimator. The enhancement, however, is not as drastic as that by the increase in collimator thickness.
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