Abstract
Abstract The choice of a reactor concept is vital for the success of a research project in plasma-enhanced chemical vapour deposition (PECVD). Two reactor designs are introduced. The so-called remote PECVD (RPECVD) design is characterized by the separation of the plasma from the reaction zone. The moving electrode (ME) concept incorporates a paralle plate reactor with adjustable electrode spacing. Examples are presented to demonstrate applications of the two concepts. Evaluation of a new precursor for Si-X (X = C, N x , O 2 , etc.) films is accomplished with RPECVD. RPECVD is also suitable for the treatment of sensitive substates (III–V) semiconductors, plastics). In turn, ME-PECVD should be destined for purposes where two or more process steps have to be combined. An example is proposed with a novel intermetal dielectric process.
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