Abstract
Plasma enhanced chemical vapour deposition (PECVD) has become an important thin film deposition technique. Beside deposition rate qualitative film properties like hardness are of main interest. But, there is still little understanding about the correlation between deposition rate, film attributes and process parameters. A semiempirical model for remote PECVD is developed to distinguish between the energy and monomer deficient region. At various oxygen flows dynamic film hardness is measured and compared with the monomer conversion ratio. With the help ofthe overall model significant similarities are observed underlining the dominating role of atomic oxygen in remote PECVD with oxygen as carrier gas.
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