Abstract
Newport Corporation has introduced the MRSI-605 AP Advanced Packaging Die Bonder, providing advanced assembly solutions for epoxy die attach, eutectic, and flip chip bonding. The system is designed for end users in the semiconductor and electronic packaging markets, including manufacturers of MEMS, advanced semiconductor packages, multi-chip modules, military and defence hybrids, microwave and RF circuits, and photonics packages. This is a short news story only. Visit www.three-fives.com for the latest advanced semiconductor industry news.
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