Modelling the Growth and Etch of Thin Film Metal Oxides

Abstract

HfO2 and ZrO2 are two high-k materials that are crucial in semiconductor devices. Atomic level control of material processing is required for fabrication of thin films of these materials at nanoscale device sizes. Atomic layer deposition (ALD) and thermal atomic layer etching (ALE) allow fabrication of ultra-thin films for semiconductor device processing. ALD is a well-known metal oxide thin film deposition technique in which metal and oxygen containing precursors are added sequentially to the reactor to ensure self-limiting precursor adsorption and reaction to enable a high level of control over film thickness. Thermal ALE, which is a relatively modern technique, uses self-limiting fluorination (using hydrogen fluoride exposure) and subsequent ligand exchange reactions at elevated temperatures to remove up to a monolayer of the metal oxide material. This modern approach for controlled etching is the reverse of ALD and removes only the fluorinated layer.Given that it is difficult to investigate ALD and ALE reactions directly using experimental techniques, first-principles-based atomic-level simulations using density functional theory (DFT) can give deep insights into the precursor chemistry and the reactions that drive the deposition and etch of different materials. This contribution presents first principles density functional theory modelling to examine the growth and etch of thin films of HfO2 and ZrO2. Concerning the ALD reaction, the adsorption mechanism of precursors TDMAHf and TDMAZr are studied at the bare and hydroxylated surfaces of HfO2 and ZrO2 respectively. Stable OH coverages of 0.50 ML and 0.63 ML on the surfaces of HfO2 and ZrO2 were found respectively. Ligand loss from the metal precursor can be achieved by protonation from the OH terminated surface of both metal oxides. Concerning the ALE reaction, HF exposures on the surfaces of HfO2 and ZrO2 are studied. HF coverages ranging from 1.0 ± 0.3 to 17.0 ± 0.3 HF/nm2 are investigated and a mixture of molecularly and dissociatively adsorbed HF molecules is present at higher coverages. Theoretical etch rates of -0.61 ± 0.02 Å /cycle for HfO2 and -0.57 ± 0.02 Å /cycle ZrO2 were calculated using maximum coverages of 7.0 ± 0.3 and 6.5 ± 0.3 M-F bonds/nm2 respectively (M = Hf, Zr).