A Mechanistic Study of the HF Pulse in the Thermal Atomic Layer Etch of Crystalline and Amorphous HfO2

Abstract

HfO2 is a high-k material that is crucial in semiconductor devices. Atomic-level control of material processing is required for the fabrication of thin films of this material at nanoscale device sizes. Atomic layer deposition (ALD) and thermal atomic layer etching (ALE) allow the fabrication of ultra-thin films for semiconductor device processing. ALD is a well-known metal oxide thin film deposition technique that enables a high level of control over film thickness. Thermal ALE, which is growing in importance, uses self-limiting halogenation (e.g. HF exposure) producing a non-volatile modified layer. Subsequent ligand exchange reactions remove up to a monolayer of the metal oxide. This modern approach for controlled etching is the reverse of ALD. In gate oxides, the use of amorphous materials is better than crystalline films as the lack of grain boundaries allow for a high breakdown voltage. Amorphous materials have a lower density than crystalline materials.Experimental studies have shown that HfO2 amorphous films have higher etch rates per cycle than crystalline HfO2 films regardless of the fluorination reactant. Given that it is difficult to investigate ALE reactions directly using experimental techniques, first-principles-based atomic-level simulations using density functional theory (DFT) can give deep insights into the precursor chemistry and the reactions that drive the etch of different materials. This contribution presents first-principles density functional theory modelling to examine the etch chemistry of crystalline and amorphous films of HfO2. HF molecules adsorb on the surface of HfO2 by forming hydrogen bonds and may remain intact or dissociate to form Hf-F and O-H bonds. The adsorption of one HF molecule at the bare surface of both the crystalline and amorphous models results in dissociative adsorption at all binding sites. For multiple HF adsorption, we find mixed molecular and dissociative adsorption of HF molecules at the bare surfaces of the crystalline and amorphous models of HfO2. We also present a thermodynamic analysis approach to compare reaction models representing the self-limiting (SL) and continuous spontaneous etch (SE) processes taking place during an ALE pulse.