Mitigation of thin wafer handling issues in TSV (Through Silicon Via) fabrication for advanced packaging applications

Abstract

Present study focuses on various thin wafer handling issues associated with via-last TSV fabrication integration schemes. Thin wafer handling methodology play very key role in any successful TSV interposer fabrication. Zonebond TBDB method is selected for this evaluation and critically analysed issues encountered in various fabrication steps like PECVD, PVD, etching, curing and CMP processes. Thin TSV wafer fabrication is always challenging as thin wafers are instable and more prone to failures in various fabrication environments. Hence it is timely to establish robust thin wafer handling schemes that promote seamless TSV interposer wafer fabrication. Extensive TBDB and process integration DOE has been conducted to mitigate these issues.