Abstract
A simple chip-to-chip interconnect technique with adhesive bonded ribbons is presented. It solves the insertion loss problem of wire bond interconnects in micro- and millimeterwave assemblies. The following paper discusses design and fabrication of such interconnects. A quasistatic model is developed to ease the quality assessment of their electrical behavior. It is validated by measurements on microstrip resonators with and without interconnects. The chip-to-chip interconnect technique with adhesive bonded ribbons exhibit low loss and is useable up to 50 GHz or more.
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More From: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
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