Micr -Transfer Printing for Efficient 3DHI of 100-300mm Wafers and Glass Panels

Abstract

This paper presents an analysis of using micro-transfer printing (MTP) for three-dimensional heterogeneous integration (3DHI) of diverse components made using 100mm, 200mm and 300mm wafers with large area glass substrates. Techniques for achieving high throughput and high wafer and substrate utilization, despite their size mis-matches, are described in detail along with MTP’s pros and cons versus alternative wafer-to-wafer and die-to-wafer 3DHI technologies. MTP, a massively parallel pick-and-place process, efficiently transfers large arrays of ultra-thin (<10 micron), small, diverse components (“x-chips”) from one or more source wafers to destination substrates. MTP enables disruptive 3DHI of compound semiconductors, including GaN, GaAs, InP, SiGe and emerging materials, silicon and passive components for wireless and optical communications, power management, sensor, photonics and other analog / mixed signal applications. Since the x-chips are ultra-thin and active side up, standard copper redistribution layer (RDL) technology may be readily used to interconnect the x-chips and destination die, resulting in very short path lengths and, hence, minimum parasitics. ASM AMICRA and X Display Company supply R&D and production MTP manufacturing systems. More than twenty MTP systems are installed worldwide at X-FAB, Micross Components, Tyndall National Institute, Teledyne, the Naval Research Laboratory, the University of Illinois Urbana Champaign, the University of Ghent / imec, UPVfab and undisclosed leading manufacturers.