Method of printed circuits and semiconductor substrates material parameters extraction using wideband reflection measurements

Abstract

This paper is dedicated to a new method of high frequency circuits material properties extraction based on the reflection measurements of a line shorted two or more times along its length. The line should be fabricated on the material under test. To achieve more precise calculation results, the proposed method uses processing in the time domain. The experimental results section shows obtained assessments for relative permittivity and dielectric loss tangent of the RO4350B hydrocarbon ceramic laminate. Measurements have been conducted over the frequency range up to 20 GHz.