Material Parameters Extraction of Printed Circuits and Semiconductor Substrates Using Wideband Reflection Measurements

Abstract

This paper is dedicated to a new method of material properties extraction based on reflection measurements of a line shorted two or more times along its length. This line is fabricated on the material under test. To achieve more precise calculation results, the proposed method uses processing in time domain. The on-board experimental results section shows obtained estimates for relative permittivity and dielectric loss tangent of the RO4350B hydrocarbon ceramic laminate. These results were obtained via measurements conducted over a frequency range up to 20 GHz. On-wafer experimental results section demonstrates estimated relative permittivity of the 8130 reference material. These result were obtained via measurements including frequencies up to 70 GHz.