Mechanical Properties of Anisotropic Conductive Adhesive Film Under Hygrothermal Aging and Thermal Cycling

Abstract

Mechanical properties of anisotropic conductive adhesive film (ACF) were investigated experimentally under various environmental conditions. The temperature sweep test was conducted to investigate the effects of temperature on dynamical mechanical properties of the ACF. The ACF exhibited transitions to the glass state, viscoelastic state, and rubber state with increasing temperature, and its glass-transition temperature (Tg) was determined to be 149°C. The creep-recovery behaviors of the ACF were investigated, and it was found that the initial strains, instantaneous strains, and creep or recovery rates increased with increasing temperature. No obvious creep phenomenon was observed at low temperatures (≤0°C). The creep strain and creep rates at any time decreased with increasing hygrothermal aging time. The uniaxial tensile behaviors of the ACF were also investigated under hygrothermal aging and thermal cycling. The results show that the Young’s modulus and tensile strength of the ACF decrease with increasing hygrothermal aging time; however, they increase at first and then decrease with increasing thermal cycling time. Tg decreases slightly for the ACF after hygrothermal aging; however, it increases after thermal cycling.