Abstract
Abstract Invited Session on FUTURE SEMICONDUCTOR PACKAGES FOR AI HARDWARE. Outline: Introduction; Target of Advanced PKG Technology for HI; Technology Solution (1. New SAP Flow of Fan-out IC Substrate; 2. Fine L / S IC Substrate Patterning by Wafer Process; 3. Technology Strategy by PCM and TSV for AI Hardware; 4. Summary); and Acknowledgments.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Paper version not known
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
