Abstract

The severity of power consumption during parallel BIST of embedded memory cores is growing significantly. In order to alleviate this problem, a row bank-based precharge technique based on the divided wordline (DWL) architecture is proposed for low-power testing of embedded SRAMs. The memory cell array is first divided into row banks. The effectiveness of the row bank-based precharge technique is due to the predictable address sequence during test. In low-power test mode, instead of precharging the entire memory array, only the current accessed row bank is precharged. This will result in significant power saving for the precharge circuitry. The precharge power can be reduced to 1/b of that of the traditional precharge techniques, where b denotes the number of row banks in the memory array. With simple transmission gates and inverters, the modified precharge control circuitry was also designed. The hardware overhead for implementing the low-power technique is almost negligible. Moreover, the corresponding BIST design to implement the low-power technique is almost the same as the conventional BIST designs. It is also notable that the inherent low-power characteristics of the DWL architecture can be preserved. According to experimental results, 48.9% power reduction can be achieved for a 256 × 256 bit-oriented SRAM. The memory is divided into 8 row banks. Moreover, if the number of row banks increases, the power saving will also increase.

Highlights

  • VLSI technology keeps greatly increasing the degree of circuit integration in recent years

  • If the memory is divided into 8 row banks, 48.9% power reduction can be achieved for a 256 × 256 bit-oriented SRAM

  • The power dissipation reduction of the proposed row bankbased precharge technique depends on the memory organization

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Summary

Introduction

VLSI technology keeps greatly increasing the degree of circuit integration in recent years. With this trend, high-density and high-capacity embedded memories are often implemented in a system chip. According to the Semiconductor Industry Association (SIA, Calif, USA) and ITRS 2003, the relative silicon area occupied by embedded memories will approach 94% by 2014 [1]. Many low-power design techniques have been proposed for embedded memories [2,3,4,5]. Due to the large area occupied by embedded memories, they will dominate the yield of the system chips. There are many techniques proposed to increase the reliability and yield of system chips

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