Abstract
Interfacial structure plays a critical role for the reliability of thermoelectric (TE) device. This study investigated the interfacial evolution behavior and the reliability of CoSb 3/Ti/Mo–Cu TE joints during accelerated thermal aging. After thermal aging, three-layer intermetallic compound (IMC) structure was observed at the CoSb 3/Ti interface, and EDS analysis confirmed that the IMC layers were composed of TiCoSb, TiSb 2 and TiSb. The total thickness of IMC layers increased linearly with the square root of aging time. The growth kinetics of IMC layers was studied. The theoretic life of CoSb 3/Ti/Mo–Cu TE device was predicted using the growth rate of IMC layers. The shear strength of aged CoSb 3/Ti/Mo–Cu TE joints was also investigated and the results showed the joints had sufficient strength after aging at 575 °C for 720 h. SEM showed that, in all the aged samples, the fracture occurred inside of the IMC layers, while the fracture occurred in the Ti layer or Ti/TiSb interface in the un-aged samples.
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