Abstract
Power cycle reliability of solder joints with Sn‐5Sb (mass%) and Sn‐10Sb (mass%) alloys was investigated. The effects of power cycling and heat aging on the growth of intermetallic compound (IMC) layers at the interfaces between Sn‐Sb alloys and Cu plates were also investigated. In the power cycling test, the solder joint with Sn‐10Sb has high reliability compared with that of Sn‐5Sb. IMC layers grew in both joints with increasing number of power cycles. Compared with Sn‐5Sb and Sn‐10Sb, difference in growth kinetics of IMC layers was negligible. A similar tendency was observed in the heat aging test. Compared with the power cycling and the heat aging, growth of IMC layers at the aging temperature of 200°C is faster than that in the power cycling test at the temperature range of 100°C to 200°C, while that at the aging temperature of 100°C, the growth is slower. On the basis of the comparison between the power cycling and the heat aging, it was clarified that growth kinetics of IMC layers in the power cycling can be predicted by investigating growth kinetics of the IMC layer at the temperatures in the vicinity of the peak temperature in power cycling.
Highlights
Sn-Pb alloys have been used for the electronic products as a joint material for a long time
It was found that the growth kinetics of intermetallic compound (IMC) layers in power cycling corresponds well with that in aging at 200°C when the processing time in power cycling is dened to be the time when the joint is exposed at the temperature over 160°C. is means that the growth kinetics of IMC layers in power cycling can be predicted by investigating the growth kinetics of the IMC layer at the temperatures in the vicinity of the peak temperature in power cycling
Power cycle reliability of the solder joints with Sn-5Sb and Sn-10Sb and the e ects of processing time in the power cycling test and heat aging time on growth kinetics of IMC layers formed at the Sn-Sb/Cu interfaces were observed. e obtained results are summarized as follows
Summary
Sn-Pb alloys have been used for the electronic products as a joint material for a long time. E high-temperature solder is applied to the power semiconductor modules as a die bonding material. An Sn-Sb alloy is one of the potential substitute materials for the high-temperature Sn-Pb solder [7,8,9,10,11,12]. It has been reported that Sn-5Sb (mass%) has excellent thermal fatigue behaviors and relatively high fracture strength [13, 14]. In Sn-Sb alloys with high concentration of Sb, mechanical strength is improved by solid solution of Sb in the β-Sn matrix and dispersion of Sb-Sn compounds. There are not many reports about the heat cycle test using solder joints. The difference between growth kinetics of the intermetallic compound (IMC) layer during power cycling and that during heat aging has not been clarified yet
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