Abstract
Embedding microchannels in a 3D-IC can alleviate heat dissipation problems. In this paper, microchannel 3D-IC with alternating secondary flow channel was proposed and geometric parameters were optimized. Non-dominated Sorting Genetic Algorithm II was used for Pareto optimization. Optimization solutions (Rt_best, Pp_best and ?best) were selected in Pareto front. The optimization objective values of these solutions are all less than the corresponding values of conventional design. Based on Pareto front, a compromise solution for Technique for Order Preference by Similarity to an Ideal Solution was calculated. Compared with conventional design, the thermal resistance of Rt_best, pumping power of Pp_best, and chip uniformity index of ?best are reduced by 10.2%, 3.4% and 7.3%, respectively. Compared with conventional design, the thermal resistance, pumping power, and chip uniformity index of compromise solution based on Technique for Order Preference by Similarity to an Ideal Solution are reduced by 10.0%, 1.0% and 7.1%, respectively. The results may help the development of optimization design of the microchannel in 3D-IC.
Published Version
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