Higher Efficiency Power Module Solutions by Chip Embedding

Abstract

Abstract The development in communication handheld devices has pushed the demand for packages with high level of functionality and complexity at the same time smaller package outline and decreased package thickness. Embedding active dies and/or passive components into the substrate is fulfilling these integration requirements, but embedding can have further beneficial effects (electrical performance, thermal dissipation, shielding) that deliver more benefit for embedding (1). Whereas embedding dies in substrates seems a simple concept, it can come with strong advantages as found in the described case for Power Modules in terms of electrical performance and thermal dissipation. In this paper we shall report the development of embedded technologies for Power Modules and compare electrical performance, thermal dissipation and reliability results with other Power Module package types. We shall report on an intelligent power module for server applications up to 1.5kW consisting of a driver IC and 2 MOSFETs using embedded die in substrate technology in high volume manufacturing. We will describe the development of next generation embedding technologies for Power Modules, their expected benefits and respective application targets together with simulation results. We conclude with a brief overview of the challenges that come with embedded packaging supply chain.