High-Frequency Performance of TAB

Abstract

The high-performance capability of tape automated bonding (TAB) is explored by developing simple equivalent circuits that allow estimates of signal fidelity, crosstalk, power capabilities, and power signal interactions. A useful experimental technique for isolating cause and effect is used to illustrate power delta-I noise. Improvements in power and signal behavior are proposed, which result from careful attention to the placement of the signal I/O relative to the ground and power leads. Lastly, the performance limits encountered in chip-on-tape testing and how the signal fidelity can be improved by tape design and layout are discussed.