Package inductance measurement at high frequencies

Abstract

A major task in electrical characterization of IC packages is the experimental determination of package R, L, and C. A package self-inductance measurement technique based on network analysis and a lumped-element package model is described. Advantages of this technique include measuring inductance at the high operating frequencies of today's high-speed CMOS and ECL chips, providing information on a package's resonance frequencies and the limit of the lumped-element model, being inherently more accurate than techniques that measure package inductance at lower frequencies, and utilizing a simple one-port measurement method, procedure, and fixture design. Different packages and interconnects including a 160 QFP (quad flat package), a 296-lead TAB (tape automated bonding) tape, a flip TAB structure, and bonding wires of different length were characterized using this technique. >