296 lead fine pitch (0.4 mm) thin plastic QFP package with TAB interconnect

Abstract

The quad flat pack (QFP) package has become the surface mount technology (SMT) package of choice for microprocessors and peripheral devices and is well suited for hand held computer application. To address this market segment Intel has developed a new package with a thin (2.0 mm) body for light weight, low standoff (0.25 mm maximum) for overall lower profile, in a 32 mm/spl times/32 mm body format. Tape automated bonding (TAB) interconnect from die to the leadframe is used to overcome wirebond interconnect limitations. This package provides a more manufacturable package system by using flat handling during test operation. The package is trimmed and formed subsequent to test operation and shipped in standard JEDEC thin matrix plastic trays, ready to use for SMT operation with good lead coplanarity. Package reliability is equivalent to other plastic packages. Sample packages were supplied to selected customers to help develop the 0.4 mm pin pitch SMT process, equipment and materials. The feedback/results indicate that the current base of installed SMT equipment is capable of assembling such 0.4-mm pitch packages with very little or no modification and at acceptable quality levels. >