Abstract
The data processing requirements that arise when integrating housing and circuitry by means of three-dimensional molded interconnection devices (3-D-MIDs) are addressed. An overview of these requirements is given, and promising steps for integrating the functionality of CAD systems for electronic (ECAD) and mechanical (MCAD) applications are described. >
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Schedule a callMore From: IEEE Transactions on Components, Hybrids, and Manufacturing Technology
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