Abstract
A method for wideband characterization and modeling of tape automated bonding (TAB) packages using time-domain techniques is described. The method uses time-domain reflectometry data along with the modified transient circuit analysis package (MTCAP) to develop a physically based equivalent circuit model. The model accurately simulates the TAB over a wide band of frequencies (DC to >25 GHz). Computer simulations based on the model were performed to predict TAB performance parameters. Results of both the experimental measurements and computer simulations are presented. >
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