Heterogeneous Integration of III-V Lasers in a 300 mm CMOS Manufacturing Line

Abstract

AIM Photonics has developed a high precision laser attach process using an ultra-precise ASM Amicra NANO 300 mm die-to-wafer flip-chip bonder and integrated solder stamping system. Laser die are placed with high accuracy (<1 µm) and soldered to form a AuSn eutectic bond. This photonic platform has low optical losses, with SiN waveguides measuring on the order of 0.4 dB/cm and a calculated laser-to-waveguide coupling loss of 1.86 dB.