Abstract
Lotus-type porous structure is a new kind of micro-channel structure and can be used as heat sink for heat elimination of high powered electronic devices. Numerical analysis based on the simple fin model was used to predict the equivalent heat transfer coefficient of lotus-type porous copper micro-channel heat sink. Compared with the water, GaInSn working fluid could further promote the heat transfer performance of the heat sink. According to the theoretical analysis, a heat transfer coefficient as high as 14W/(cm2K) was attainable when the pressure drop was 50 KPa and an appropriate structure parameters: 0.4 mm in pore diameter, 0.4 in porosity and 4mm in height of porous copper were achieved.
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