Abstract
Lotus-type porous copper is a new kind of micro-channel structure with long cylindrical pores (channels) aligned in one direction. It can be used as a heat sink for cooling of high-power electronic components. Through experiments and Fluent-3D numerical simulations, the heat transfer performance of a lotus-type porous copper heat sink with a liquid GaInSn coolant was systematically studied under different struc- tural and hydrodynamic parameters conditions. The experimental results showed that this kind of heat sink has an excellent heat transfer coefficient, as high as 9.6 W/cm 2 K, only under a fixed pressure drop as low as 17.5 kPa. The simulation showed that optimal porosity and pore diameter existed for the heat sink to conduct a maximal equivalent heat transfer coefficient. For the GaInSn coolant, the optimal porosity and pore diameter were about 45-55% and 0.7-0.9 mm, respectively. However, at the same pressure drop conditions the optimal pore diameter for the water coolant was smaller (0.1-0.2 mm) and the optimal porosity was the same as that for the GaInSn coolant. Overall, the simulated heat transfer coefficients and structural parameters window agreed well with the experimental results.
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