Heat transfer performance of a porous copper micro-channel heat sink

Abstract

A novel porous copper micro-channel heat sink based on the high thermal conductivity and structural stability of porous copper micro-channel material is proposed in this study. A circular cross-sectional and a multi-layer staggered arrangement are the main characteristics of the micro-channel heat sink. Additionally, a heat dissipation model is produced for porous copper micro-channel heat sink by analyzing the heat transfer process. Further, the theoretical heat transfer coefficient is calculated using MATLAB, and the experimental heat transfer coefficient is determined based on an experimental platform. The heat dissipation model is verified by comparing the theoretical and experimental heat transfer coefficients. The relation between the porous copper micro-channel heat sink parameters and the heat transfer coefficient that is obtained based on the heat dissipation model of the porous copper micro-channel heat sink is analyzed. The results exhibit that variations in pore diameter, porosity, porous copper length, porous copper width, porous copper height, and volume flow significantly affect the heat transfer performance.