Abstract
Corrosion of stainless steel in a flow soldering bath by a lead-free solder was investigated using a cone-plate-type rotational viscometer. The rotational torque of the stainless-steel cone in contact with a molten solder was measured at various shear rates. The delicate measured torque was related to the change of the viscosity of the solder owing to dissolution of materials originating from the cone. The estimated viscosity coefficient was ten times greater than the values which have been reported. The result was attributed to the tin content of the solder combined with oxygen from the passive state oxide film on the cone surface. The increase of the viscosity of the silver-containing solder was much greater than in case of pure Sn.
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