Abstract
Zn/Al and Zn/Al/Cu clad materials have been developed for high-temperature die attachment. The clad structure is used in an attempt to improve the wettability of Zn-Al solder by preventing oxidation of Zn and Al. The materials were produced by clad-rolling of Zn, Al, and Cu strips, and they act as a solder following eutectic melting at temperatures above 382°C. The wettability, bondability, and reliability of the clad materials were evaluated. It was found that the Zn/Al/Cu clad material could be used under an atmospheric oxygen concentration of 100 ppm. In addition, the thermal cycle life of a chip-to-substrate joint formed using the Zn/Al/Cu clad material was longer than that using Pb-Sn-Ag solder.
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