Abstract
Three-layer Zn/Al/Zn clad solders have been developed for high-temperature die attachment. The clad structure is used to improve the wettability and bondability of Zn-Al eutectic solder by preventing Al oxidation. The effects of the bonding conditions on the bondability with Zn/Al/Zn clad solder were investigated. Bonding was achieved in the temperature range from 385°C to 420°C under N2 atmosphere with oxygen concentration below 100 ppm. However, the bonding strength of the joint formed under N2 + 4% H2 atmosphere was almost 0 MPa, and stripe defects and air gaps remained in the bond layer. To improve the bondability under N2 + 4% H2 and expand the application range, a five-layer Cu/Zn/Al/Zn/Cu clad solder was developed in an attempt to prevent the Zn layers from being oxidized by the outer Cu layers. Cross-sectional observation of the Cu/Zn/Al/Zn/Cu clad solder revealed that the surface was covered by a Cu layer, and that Cu5Zn8 layers grew between the Cu and Zn layers. This clad solder exhibited high shear strength of over 80 MPa when formed under N2 + 4% H2 atmosphere, and no stripe defects or air gaps were observed in the bond layer.
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