Evaluating the 300 mm wafer-handling task in semiconductor industry

Abstract

The semiconductor industry is moving from the production of 200mm wafers to 300mm wafers. With the increase in wafer size, the workload of wafer handling tasks is also increasing. This study evaluated the operator's handling capability, and the risk of having musculoskeletal disorders (MSDs) for handling 300mm wafers. Twenty-four female operators from a semiconductor manufacturing company participated in the experiment. Subject’s psychophysical, and physiological responses were measured. Posture analysis and biomechanics analysis were also conducted to evaluate the local strain at different joints. The results suggest that loading and unloading front opening universal pod (FOUP) at 90/90cm is best for enhancing handling capability, wrist posture, and minimizing L5/S1 compression force. About 30% of the operator's FOUP handling capabilities were lower than the safe load limit (25%ile Maximal alleptable weight of lift) recommended by SEMI (Semiconductor Equipment and Materials International). Handling wafers at 90/125 tends to increase the risk of causing shoulder and wrist injuries. Handling wafers at 90/35 tends to induce greater strength loading at hip joint, and cause greater wrist radial deviation. To minimize the risk of having MSDs, countermeasures such as training appropriate method of FOUP handling, minimizing manual carrying, specifying ergonomic machine equipment interface, and assigning male operators for high frequency FOUP handling tasks were proposed. Positive feedbacks are obtained. Relevance to industryThe results of this study provided useful information to improve the design of 300mm wafer handling task, which enhanced the safety and health of operators in the semiconductor manufacturing workplace.