Abstract
The problems of electromigration and crevice, or crack, formation in thin metallic films are reviewed. Various measurement techniques of electromigration in thin films are descrived. The effect of several variables on electromigration are discussed. It is shown that alternating currents can also cause electromigration damage. The mechanism of crack formation in thin films deposited over steps in the substrate is described. Possible ways to avoid crack formation are discussed.
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