Effect of rapid thermal annealing on gate induced drain leakage in a n-channel metal-oxide-semiconductor field effect transistor

Abstract

Significant gate induced drain leakage caused by post-oxide rapid thermal annealing (RTA) was studied in this letter in comparison with the non-RTA process for n-channel metal-oxide- semiconductor field effect transistor. It is found that the sub-breakdown leakage increases with increasing RTA temperature. We proposed that interface states and recombination centers generated after RTA are the dominant factors in the enhancement of the leakage current. In addition, it is found that RTA has no effect on the avalanche breakdown voltage.