Abstract
Growing interest in and proliferation of heterogeneously integrated microsystems for enhanced performance of modules and microsystems. Recent years have seen significant adoption of these technologies in commercial applications, driven by major fabless device companies and 1 1st -tier vertically integrated foundries & OSATs. 67% of semiconductor wafer production at > 40nm node (Mario Morales, IDC presentation at 2022 WLPS) → integration of legacy and leading edge device technologies to produce microsystems.
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