Dielectric breakdown of polyimide films: Area, thickness and temperature dependence

Abstract

Changes in the dielectric breakdown field of polyimide (PI) films have been studied from 25 to 400°C under dc ramps. Both the area (from 0.0707 to 19.635 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> ) and thickness (from 1.4 to 6.7 ¿m) dependences of the dielectric breakdown field have been carried out using the Weibull distribution function. The 63%-breakdown field value (i.e. the ¿-scale parameter) of PI shows a decrease with increasing area, thickness and temperature but always remains above 2 MV/cm. The ß-scale parameter of the distribution shows a typical decrease with increasing area, however, it exhibits an increase with increasing thickness. This 'curious' behavior is discussed on the basis of the percolation theory. No temperature-dependence is clearly observed. Moreover, physical interpretations are carried out using the pre-breakdown current analysis.