Abstract
Abstract New devices for a digital lifestyle like augmented reality (AR) glasses may find their wide spread use only if consumer relevant pricing can be achieved. Low cost RGB-light sources are a key element for AR. assembly productivity for these micro opto-electrical RGB-light sources and a further reduction in their package dimensions. We present our new approach to build miniature RGB-light sources on structured silicon wafers and elaborate the required skill set and our future process infrastructure based on our existing high volume capable optical packaging platform. The platform provides an optical bench with integrated heat spreader and emission windows enabling miniature hermetic housing for laser diodes assemblies on 8″ wafers.
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