Abstract

Miniaturized RGB-laser light sources could become an enabler for fashionable augmented and mixed reality glasses. Increased assembly productivity for these micro opto-electrical RGB-light sources and a further reduction in their package dimensions are mandatory. We present our new approach to build miniature RGB-light sources on structured silicon wafers. These are part of our optical packaging platform that enables efficient assemblies with controlled working environments for long term performance of semiconductor laser sources. The platform provides an optical bench with integrated heat spreader and emission windows enabling miniature hermet ic housing for laser diodes assemblies on 8” wafers or chip level.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.