Crosstalk Noise of Octagonal TSV Array Arrangement Based on Different Input Signal

Ziyu Liu,Wei Zhang,Han Jiang,Ziyuan Zhu,Qingqing Sun,Lin Chen

doi:10.3390/pr10020260

Ziyu Liu, Wei Zhang + Show 4 more

Open Access

https://doi.org/10.3390/pr10020260

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Abstract

This paper proposes an octagonal layout for enhancing the ability of resisting electromagnetic interference in Through Silicon Via (TSV) array. The influential factors of crosstalk noise between TSVs are investigated, including the TSV pitch, signal and ground TSVs location, and signal types (single-end and differential signal) by using a coplanar wave guide (CPW) testing structure. These results, based on traditional TSV arrays, show that a staggered TSV layout with differential signals had lower crosstalk noise. On this basis, the octagonal layout of TSV array is proposed and we show that it has obvious superiority in reducing occupied silicon area and crosstalk noise. Compared with traditional TSV arrays, the crosstalk noise is almost reduced by 44%. In order to further reduce the silicon area occupied by TSV without worsening crosstalk noise, the new division TSV structure is proposed in which a large TSV was substituted by four smaller TSVs. The area occupied by a single TSV and TSV array are both reduced by 60% without decreasing signal integrity when the regular TSV in the octagonal layout are replaced by a new TSV structure.

Highlights

Three dimensional (3D) integration has become one of the most critical technologies in the post-Moore era
When the frequency is over 20 GHz, the crosstalk noise is reduced by 15 dB, 5 dB and 2 dB, respectively
To further decrease the crosstalk noise, we summarize the effect of two traditional Through Silicon Via (TSV) arrays with single-end and differential signals on suppressing crosstalk noise

Summary

Introduction

Three dimensional (3D) integration has become one of the most critical technologies in the post-Moore era. The vertical interconnection of TSV can reduce the length of the interconnection path and decrease the signal delay As well, it can save the silicon area and increase integration density. The signal is transmitted through the TSV array and thousands of TSVs are placed in the limited silicon chip area. This often causes great electromagnetic interference, including crosstalk noise, which will affect the signal integrity transmitted through TSV [2]. Optimizing TSV arrays with signal/ground TSVs to reduce the crosstalk noise has large significance in determining signal integrity. TSV arrays should have less ground TSV and occupy less silicon wafer area, which conflicts with better crosstalk noise performance.

TSV Array Design

New Divison TSV Structure

Results and Discussion

Conclusions