Abstract
Cross-linked polyethylene (XLPE) is commonly used in medium/high voltage insulation due to its excellent dielectric properties and acceptable thermomechanical properties. To improve both electrical and thermal properties to a point that would possibly avoid the need for crosslinking, nanoclay fillers can be added to polymer matrix to form nanocomposites materials. In this paper, PE/clay nanocomposites were processed by mixing a commercially available premixed polyethylene/O-MMT masterbatch into a polyethylene blend matrix containing 80 wt% low density polyethylene LDPE and 20 wt% high density polyethylene HDPE with and without compatibilizer using a corotating twin-screw extruder. Various characterization techniques were employed in this paper, including optical microscopy, AFM, TEM, TGA, DMTA, and dielectric breakdown measurements in order to understand the correlation between structure and short-term dielectric breakdown strength.
Highlights
Polyethylene is the insulation dielectric material of choice because of its high dielectric strength coupled with low dielectric loss, in addition to lending itself to easy processing
It has been suggested that adding nanoclay can significantly decrease charge accumulation, which leads to increase in dielectric breakdown strength [17]
These results show that the thermal stability of the nanocomposite materials is Sample PE PE/O-MMT PE/O-MMT/PE-MA
Summary
Polyethylene is the insulation dielectric material of choice because of its high dielectric strength coupled with low dielectric loss, in addition to lending itself to easy processing. It has been reported that adding microfiller has a negative effect on dielectric breakdown strength [1] due to the enhancement of the electric field around the aggregated filler particles, leading to decreased breakdown strength. To overcome these limitations, nanocomposite was used as an alternative to replace conventional composite [1,2,3,4,5,6,7,8,9,10,11,12,13,14,15]. Microscopic observation, thermal behavior, and dynamic mechanical thermal analysis, as well as short-term dielectric breakdown, have been studied
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