Abstract
Our technical approach for high light extraction is forming well-defined cone-like structures without any deterioration of the light-emitting diode (LED) surface. The laser lift off (LLO) technique combined with photo electrochemical etching (PEC) allows for the development of a high light extraction structure. The extraction efficiency enhancement produced a four-fold increase for an unencapuslated chip compared with a conventionally processed LED. (© 2005 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)
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